Blind Inc.

Join a team recognized for leadership, innovation, and diversity

Join a team that designs, fabricates, assembles and test high reliability integrated circuits and sensors for Honeywell Aerospace. You will be primarily responsible for supporting manufacturing operations in the Integrated Circuit Assembly area. Priorities include evaluating new and currently existing products using metrology equipment to influence the planning and designing of manufacturing engineering processes pertaining to semiconductor device fabrication. You will be part of an integrated production team, responsible for achieving manufacturing goals.

You will work closely with world class hardware and design engineers during the planning, design, test, and integration phases of IC product development. You will perform multiple engineering activities to ensure the production of quality and cost-effective material, emphasizing continuous improvement activities.

Key Responsibilities

• Work with cross functional team to assemble IC sensors in a cleanroom environment.

• Responsible for wire bond processing, solder melt, solder reflow and seam weld sealing processes for Semiconductor product line.

• Assist design engineering in the development, process refinement, problem resolution, and yield enhancement activities during new product development phase of product life cycle.

• Perform database management functions for product line.

• Manage work priorities and commitments to maximize benefit to multiple manufacturing and developmental organizations.

U.S. PERSON REQUIREMENTS

Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen. Dual Citizenship is not allowed due to contractual requirements

“The annual base salary range for this position is $87,200 to $109,000. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.”

YOU MUST HAVE

• Bachelor’s Degree in related field

• US Citizenship due to contractual requirements

• Dual Citizenship is not allowed due to contractual requirements

• Previously held USG Secret clearance, or no known barriers to achieve a USG Secret security clearance

• Ability and willingness to work on-site at Honeywell Aerospace

WE VALUE

• 1-3 Year Experience in a Semi-Conductor Manufacturing role

• Previous experience with IC Assembly processing or other sensor assembly processing

• Knowledge of Mil Specifications and QML quality standards

• Prior experience with wire bonding, solder sealing, and vacuum sealing on sensor products

• Experience with flip chip or column attach of semiconductor devices

• Previous experience with plastic packaging of electronic sensors

• Database management experience

• Prior experience with yield analysis techniques and evaluation

• Ability to interact with other technical personnel

U.S. PERSON REQUIREMENTS

Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen. Dual Citizenship is not allowed due to contractual requirements

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.